Electronics Points

Researchers from Graz University of Technology (TU Graz) and Silicon Austria Labs (SAL) are partnering up to advance the development

Researchers from Dresden, Chemnitz, and Osaka have announced the first fully integrated flexible electronics, thus opening the path towards the

Scientists from Linköping University and SweGaN have discovered a new method to fit together layers of semiconductors as thin as

Researchers from the Tokyo Institute of Technology have analysed a new material combination that explores magnetic random access memories (MRAM)

STMicroelectronics (ST) has acquired Swedish silicon carbide (SiC) wafer manufacturer Norstel AB, the company announced on December 2nd, 2019. Read

Unlike the typical antennas, which are usually made of metal conductors like aluminium, copper and silver, the new antennas introduced

Researchers from the Worcester Polytechnic Institute have coordinated an international team and discovered a number of security vulnerabilities in computer

Researchers from the School of Electrical Engineering at KAIST (Korea Advanced Institute of Science and Technology) have created a multifunctional

École Polytechnique Fédérale de Lausanne (EPFL) has revealed a metallic microdevice that allows for superconductivity patterns to be defined and

During the annual Samsung Tech Day 2019, the tech giant announced that they had started mass production of the 12-gigabyte