Intel Looks to Improve Backside Power Delivery with new RibbonFET and PowerVia Architectures
Intel announced the company’s future process and packaging technology roadmaps at its “Accelerated” webcast last week.
- New faces at 1Kosmos, Transmit Security, Identiv, Okta, Prodigy
- Cambridge Quantum and German Aerospace Center Partner on Quantum Computing for Better Battery Design
